RDL插入层由聚合物和铜布线组成 ... SoIC包含CoW（Chip-on-wafer）和WoW（Wafer-on-wafer）两种技术形态，从TSMC的描述来看，SoIC是一种WoW晶圆对晶圆或CoW ...

A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...

The systemrdl-compiler project implements a generic compiler front-end for Accellera's SystemRDL 2.0 register description language. The goal of this project is to provide a free and open compiler that ...

半导体制造流程包含前道晶圆制造与后道封装测试两大关键工序。前道晶圆制造工序中，晶圆需依次经历氧化、涂胶、光刻、刻蚀、离子注入、物理 / ...

BANGKOK (AP) — The Biden administration plans to raise tariffs on solar wafers, polysilicon and some tungsten products from China to protect U.S. clean energy businesses. The notice from the U.S ...

Different from silicon interposers that can be created only from circular wafers, glass and other organic ... The development of organic redistribution layer (RDL) interposers requires the ability ...

This is especially true for each increase in wafer size or improvement in a manufacturing process. It’s why aftermarket sensors are so important. These include sensors that measure incoming and ...

CoWoS（Chip-on-Wafer-on-Substrate）封装技术，作为一种先进的2.5D封装技术 ... 台积电在CoWoS封装技术方面不断创新，推出了多种类型的封装技术，包括CoWoS-S（Silicon Interposer）、CoWoS-R（RDL Interposer）和CoWoS-L（Local Silicon Interconnect and RDL ...

Execs said the company must prioritize efficiency over "no wafer left behind." Intel has lost ground to Nvidia, Samsung, and several Taiwanese and American players. Intel has said it needs to be ...

"We are very driven toward 'no wafer left behind,'" Naga Chandrasekaran, the chief global operations officer, said at the UBS Global Technology and AI Conference on Wednesday. But Intel needs a ...

Today’s most advanced computer chips are a mere few dozen nanometers in size. While powerful chips, including those from NVIDIA and TSMC, continue down the miniaturization path, Cerebras is bucking ...