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26 分钟
Recover Red Introduces Portable Red Light Therapy Solution: The Power Stack
RLT aids in muscle recovery by reducing inflammation and improving circulation. Athletes and fitness enthusiasts rely on it ...
7 小时
on MSN
This universal processor combines CPU, GPU, DSP and FPGA in one chip
Ubitium’s universal processor is designed to be scalable, supporting a portfolio of chips that vary in size but share ...
9 小时
QUALCOMML: Edge-AI Computing Is Sneaking Up Everywhere
Qualcomm is diversifying beyond mobile handsets into automotive, IoT, and PCs, driven by edge-AI applications, boosting ...
1 天
Poco X7 and Poco X7 Pro Design Leaks Along With Key Specifications
Peek into the Poco X7 and POCO X7 Pro, featuring cutting-edge AMOLED displays, Dimensity CPUs and robust camera systems.
pv magazine International
2 天
Perovskite-HJT tandem solar cell based on phosphonic acid, self-assembled monolayer ...
Researchers in Switzerland have fabricated a perovskite-silicon tandem solar cells that utilizes a heterojunction cell as ...
Analytics Insight
3 天
Samsung Galaxy S25 Ultra vs iPhone 17 Air: A Clash of Titans in 2025
The competition between Samsung and Apple reaches new heights in 2025 with the Samsung Galaxy S25 Ultra and iPhone 17 Air ...
Knowridge
4 天
MIT’s new stacked chip design could revolutionize computing
The electronics industry is facing a challenge: it’s running out of space to pack more transistors onto computer chips. To ...
AZoBuild
6 天
CFD Evaluates Passive Cooling in Heritage Homes
CFD simulations reveal effective natural ventilation methods for historic homes in San Antonio, balancing energy efficiency ...
6 天
6 Best Stackable Washers and Dryers to Save Space
The best stackable washer dryer combo sets include smart, electric and gas washer and dryers and front-loading and ...
7 天
Homey launches affordable smart home hub for less than $200
Smart home brand Homey has unveiled the Homey Pro Mini, a more compact and affordable version of its flagship $400 Homey Pro ...
Semiconductor Engineering
7 天
Strain, Stress In Advanced Packages Drives New Design Approaches
Heterogenous integration is pushing chip and package designers to consider multi-physics effects as early as the initial ...
Semiconductor Engineering
7 天
Achieving Successful Multi-Die Signoff
Multi-die designs require advanced parasitic extraction, power analysis, and physical checks. Multi-die designs leveraging ...
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