Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

The U.S. Commerce Department said on Tuesday it has finalized $406 million in government grants to Taiwan's GlobalWafers to ...

First-quarter 2021 silicon wafer shipments saw 14% growth from the 2,920 million square inches logged during the same quarter last year. “Logic and foundry continue to drive strong demand for silicon ...